Flat panel display

ABSTRACT

A flat panel display (FPD) including a display panel for displaying an image; a film substrate electrically connected to the display panel, the film substrate including driving circuits; a printed circuit board (PCB) electrically connected to the film substrate, the printed circuit board providing a signal for displaying the image; and a heat radiating unit attached to one surface of the film substrate, the heat radiating unit contacting at least one of the display panel and the PCB.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims priority under 35 U.S.C. §119 to Korean PatentApplication No. 10-2012-0121376, filed on Oct. 30, 2012, in the KoreanIntellectual Property Office, the entire content of which isincorporated herein by reference.

BACKGROUND

1. Field

Embodiments relate to a flat panel display (FPD).

2. Description of the Related Art

A flat panel display (FPD), e.g., a liquid crystal display (LCD) and anorganic light emitting display (OLED), may include a display panel (fordisplaying an image) and driving circuits (for providing signals to thedisplay panel) in order to display the image.

In the display panel, a plurality of pixels may be connected between aplurality of scan lines and data lines, e.g., in a matrix. The drivingcircuits may include scan driving circuits (for driving the plurality ofscan lines) and data driving circuits (for driving the plurality of datalines). Scan signals may be sequentially supplied from the scan drivingcircuits to the plurality of scan lines so that pixels are selected, anddata signals may be supplied from the data driving circuits to the datalines connected to the selected pixels so that a predetermined image isdisplayed.

As the resolution of the FPD increases, a number of scan lines and datalines increases, so that the size of the driving circuits and the numberof driving circuits increase. The increase in the size of the drivingcircuits means an increase in channels. The power consumption of thedriving circuits may increase as the channels increase. Thus, heatemission may increase. In the case of the display panel that displays ahigh resolution image or a three-dimensional image, the driving circuitsshould operate at high speed. Thus, a problem may be generated by heatemission.

SUMMARY

Accordingly, the embodiments provide a flat panel display (FPD) capableof effectively radiating heat generated by driving circuits.

In order to achieve the foregoing and/or other aspects of theembodiments, there is provided a flat panel display (FPD), including adisplay panel for displaying an image, film substrates electricallyconnected to the display panel and including driving circuits, printedcircuit boards (PCB) electrically connected to the film substrates toprovide a signal for displaying the image, and heat radiating unitsattached to one surface of each of the film substrates and contacting atleast one of the display panel and the PCBs.

Each of the heat radiating units may include a first contacting unitattached to one surface of the film substrate and at least one secondcontacting unit that protrudes from an edge of the first contacting unitto the outside and that contacts at least one of the display panel andthe PCB.

The heat radiating units may be formed of a thin film-shaped thermallyconductive material and may be attached to one surface of each of thefilm substrate by an adhesive including heat radiating paste.

Protrusions may be provided on at least one surface of the heatradiating unit. Metal pads may be provided in the display panel and thePCBs that the heat radiating units contact.

According to the embodiments, heat generated by the driving circuits andheat generated by input terminals, output terminals, and pads may berapidly radiated to the outside by the heat radiating units and may bedelivered to the display panel and the PCBs through the heat radiatingunits. Thus, it is possible to prevent the driving circuits from beingdefective due to accumulation of heat.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, together with the specification, illustrateexemplary embodiments, and, together with the description, serve toexplain the principles of the embodiments.

FIG. 1 illustrates a schematic plan view of a flat panel display (FPD)according to an embodiment;

FIG. 2 illustrates a plan view of an embodiment of the heat radiatingunit of FIG. 1;

FIG. 3 illustrates a sectional view taken along the line I1-I2 of FIG.1;

FIGS. 4 and 5 illustrate sectional views taken along the line I11-I12 ofFIG. 1; and

FIG. 6 illustrates a plan view illustrating another embodiment of theheat radiating unit of FIG. 1.

DETAILED DESCRIPTION

The embodiments now will be described more fully with reference to theaccompanying drawings. The embodiments may, however, be embodied in manydifferent forms and should not be construed as being limited to theembodiments set forth herein; rather, these embodiments are provided sothat this disclosure will be thorough and complete, and will fullyconvey the concept of the embodiments to those skilled in the art.

FIG. 1 illustrates a schematic plan view illustrating a flat paneldisplay (FPD) according to an embodiment.

Referring to FIG. 1, the FPD may include a display panel 100 (fordisplaying an image), a film substrate 200 electrically connected to thedisplay panel 100, a printed circuit board (PCB) 300 electricallyconnected to the film substrate 200, and a heat radiating unit 400attached to a bottom of the film substrate 200 to contact at least oneof the display panel 100 and the PCB 300.

The display panel 100 may include a first substrate 110, a secondsubstrate 120, and a pixel array between the first substrate 110 and thesecond substrate 120.

The first substrate 110 and the second substrate 120 may be formed of,e.g., a transparent material such as glass and quartz or an opaquematerial such as metal. The first substrate 110 may include a displayarea 112 and a non-display area 114 around the display area 112. Thesecond substrate 120 may be on the first substrate 110 including thedisplay area 112 and a part of the non-display area 114. A sealingmaterial 130 may be formed between the first substrate 110 and thesecond substrate 120 of the non-display area 114 to surround the displayarea 112. The pixel array provided between the first substrate 110 andthe second substrate 120 of the display area 112 may be sealed up by thesealing material 130.

The pixel array may include a plurality of pixels connected between aplurality of scan lines and a plurality of data lines, e.g., in amatrix, and may include liquid crystal cells or organic light emittingdiodes (OLED) and may further include thin film transistors (TFT) andcapacitors for driving the pixels.

The film substrate 200 may include a driving circuit 210. The drivingcircuit 210 (in the form of integrated circuit (IC) chips) may bemounted on the film substrate 200. Input and output terminals of thedriving circuit 210 may be electrically connected to wiring lines (notshown) on the film substrate 200. The film substrate 200 may be in theform of, e.g., a chip on film (COF). The driving circuit 210 may beformed of a scan driving circuit (for supplying scan signals to the scanlines) or a data driving circuit (for supplying data signals to the datalines).

The PCB 300 may include ICs and elements for receiving an image signalfrom an outside of the flat panel display and for generating a signalfor driving the display panel 100 and various control signals. The PCB300 may be connected to the film substrate 200 including the scandriving circuits and the film substrate 200 including the data drivingcircuits.

For example, a plurality of input pads may be formed on one side of thedisplay panel 100 to be connected to the scan lines through the wiringlines, and a plurality of film substrates 200 (including the scandriving circuits) may be electrically connected to the plurality ofinput pads. In addition, the plurality of input pads may be formed onanother side of the display panel 100 to be connected to the data linesthrough wiring lines, and a plurality of film substrates 200 (includingthe data driving circuits) may be electrically connected to theplurality of input pads.

The output terminals of the PCB 300 may be electrically connected to theinput terminals of the film substrate 200, and the output terminals ofthe film substrate 200 may be electrically connected to the input padsof the display panel 100. The output terminals and the input terminalsand/or the output terminals and the input pads may be arranged tooverlap each other and may be compressed with an anisotropic conductivefilm interposed to be electrically connected to each other.

The heat radiating unit 400 (in the form of a thin film or a tape madeof a thermally conductive material) may be formed of one or more alloysincluding a metal selected from the group of Al, Cu, and W.

Referring to FIG. 2, the heat radiating unit 400 may include a firstcontacting unit 400 a (having a same size as or being larger than thefilm substrate 200) and/or at least one second contacting unit 400 bthat protrudes from an edge of the first contacting unit 400 a to anoutside, e.g., away from the first contacting unit 400 a. The at leastone second contacting unit 400 b may be formed on one side of the firstcontacting unit 400 a at uniform intervals. In an implementation, the atleast one second contacting unit 400 b may be formed on both sides ofone side one by one. The heat radiating unit 400 may be in the form of,e.g., “H” or “I”.

Referring to FIG. 3, the first contacting unit 400 a of the heatradiating unit 400 may be attached to a bottom of the film substrate 200by an adhesive 420 that includes a heat radiating paste.

In an implementation, referring to FIG. 4, the second contacting units400 b of the heat radiating unit 400 may be adhered to the display panel100 and the PCB 300 by the adhesive 420 including the heat radiatingpaste.

Referring to FIG. 5, metal pads 102 and 302 may be formed on regions ofthe display panel 100 and the PCB 300 that contact the second contactingunits 400 b. The metal pads 102 and 302 may be formed of metal havinghigh thermal conductivity. In an implementation, the metal pads 102 and302 may be formed of an electrode or metal wiring line material, e.g.,Al, Cu, and W in a process of manufacturing the display panel 100 and/orthe PCBs 300. The second contacting units 400 b may contact the metalpads 102 and 302 to expedite or facilitate heat delivery and radiation.Therefore, the metal pads 102 and 302 may be formed to have an area aslarge as possible. In order to secure a large area, the metal pads 102and 103 may be connected to, e.g., a ground wiring line or a commonwiring line.

Referring to FIG. 6, at least one surface of the heat radiating unit 400may be concavo-convex. For example, protrusions 410 may be formed on onesurface or both surfaces of the heat radiating unit 400 to increase asurface area of the heat radiating unit 400 and to facilitate radiationof heat. The protrusions 410 may be formed by, e.g., etching the surfaceof the heat radiating unit 400 or by depositing another material on thesurface of the heat radiating unit 400.

As illustrated in FIG. 1, the heat radiating units 400 may contact thedisplay panel 100 and the PCBs 300. However, in an implementation, theheat radiating units 400 may contact only the display panel 100 or thePCBs 300 as desired.

In the FPD having the above structure, heat generated by the drivingcircuits 210 of the film substrates 200 may be rapidly radiated to theoutside through the surfaces of the heat radiating units 400 and may bedelivered to the display panel 100 and/or the PCB 300 through the heatradiating units 400. Thus, it is possible to effectively reduce and/orprevent the driving circuits from being damaged due to accumulation ofheat.

When the heat radiating unit 400 contacts only the film substrate 200,heat may be radiated to the outside only in accordance with an area ofthe heat radiating units 400. When an amount of heat emission is largerthan the amount of heat radiation, accumulation of heat may beinevitable. However, the heat radiating unit 400 may contact the displaypanel 100 and the PCB 300, so that heat may be radiated to the outsidewhile being delivered and may be radiated to the outside through thedisplay panel 100 and the PCB 300. Thus, heat radiation effect may beexcellent.

For example, high temperature heat may be generated by the inputterminals, the output terminals, and the pads to which a power voltageis delivered or supplied. According to the embodiments, the heatradiating unit 400 may contact parts adjacent to the input terminals,the output terminals, and the pads. Thus, problems associated withaccumulation of heat may be reduced and/or prevented.

By way of summation and review, when heat generated by the drivingcircuit is not rapidly radiated to the outside but rather isaccumulated, an erroneous operation may be caused, or the operation ofthe driving circuits may be stopped.

The embodiments provide a flat panel display (FPD) capable ofeffectively radiating heat generated by driving circuits.

For example, heat generated by the driving circuits and heat generatedby input terminals, output terminals, and pads may be radiated to theoutside and may be delivered to the display panel and the PCBs throughthe heat radiating units. Thus, it is possible to effectively reduceand/or prevent the driving circuits from being damaged due toaccumulation of heat.

While the present invention has been described in connection withcertain exemplary embodiments, it is to be understood that the inventionis not limited to the disclosed embodiments, but, on the contrary, isintended to cover various modifications and equivalent arrangementsincluded within the spirit and scope of the appended claims, andequivalents thereof.

What is claimed is:
 1. A flat panel display (FPD), comprising: a displaypanel for displaying an image; a film substrate electrically connectedto the display panel, the film substrate including driving circuits; aprinted circuit board (PCB) electrically connected to the filmsubstrate, the printed circuit board providing a signal for displayingthe image; and a heat radiating unit attached to one surface of the filmsubstrate, the heat radiating unit contacting and being in thermalcooperation with at least one of the display panel and the PCB.
 2. TheFPD as claimed in claim 1, wherein the heat radiating unit includes: afirst contacting unit attached to the one surface of the film substrate;and at least one second contacting unit that protrudes from an edge ofthe first contacting unit to an outside of the heat radiating unit, thesecond contacting unit contacting at least one of the display panel andthe PCB.
 3. The FPD as claimed in claim 1, wherein the heat radiatingunit is formed of a thin film-shaped thermally conductive material. 4.The FPD as claimed in claim 3, wherein the thermally conductive materialis formed of one or more alloys including a metal selected from thegroup of Al, Cu, and W.
 5. The FPD as claimed in claim 1, wherein theheat radiating unit is attached to the one surface of the film substrateby an adhesive including a heat radiating paste.
 6. The FPD as claimedin claim 1, wherein the heat radiating unit includes protrusions on atleast one surface thereof.
 7. The FPD as claimed in claim 1, wherein thedisplay panel and the PCB each include metal pads, the heat radiatingunit contacting the metal pads of at least one of the display panel andthe PCB.
 8. The FPD as claimed in claim 1, wherein the heat radiatingunit contacts and is in thermal cooperation with the display panel andthe PCB.
 9. A flat panel display (FPD), comprising: a display panel fordisplaying an image; a film substrate electrically connected to thedisplay panel, the film substrate including driving circuits; a printedcircuit board (PCB) electrically connected to the film substrate, theprinted circuit board providing a signal for displaying the image; and aheat radiating unit attached to one surface of the film substrate, theheat radiating unit contacting at least one of the display panel and thePCB, wherein the heat radiating unit includes: a first contacting unitattached to the one surface of the film substrate; and at least onesecond contacting unit that protrudes from an edge of the firstcontacting unit to an outside of the heat radiating unit, the secondcontacting unit contacting at least one of the display panel and thePCB.
 10. The FPD as claimed in claim 9, wherein the heat radiating unitis formed of a thin film-shaped thermally conductive material.
 11. TheFPD as claimed in claim 10, wherein the thermally conductive material isformed of one or more alloys including a metal selected from the groupof Al, Cu, and W.
 12. The FPD as claimed in claim 9, wherein the heatradiating unit is attached to the one surface of the film substrate byan adhesive including a heat radiating paste.
 13. The FPD as claimed inclaim 9, wherein the heat radiating unit includes protrusions on atleast one surface thereof.
 14. The FPD as claimed in claim 9, whereinthe display panel and the PCB each include metal pads, the heatradiating unit contacting the metal pads of at least one of the displaypanel and the PCB.